INTERNATIONAL PATENT: SIEMENS AKTIENGESELLSCHAFT FILES APPLICATION FOR "ARRANGEMENT HAVING A FIRST HEAT SINK AND A SECOND HEAT SINK"

GENEVA, Feb. 23 -- SIEMENS AKTIENGESELLSCHAFT (Werner-von-Siemens-StraBe 180333 Munchen) filed a patent application (PCT/EP2025/070808) for "ARRANGEMENT HAVING A FIRST HEAT SINK AND A SECOND HEAT SINK" on Jul 21, 2025. With publication no. WO/2026/037595, the details related to the patent application was published on Feb 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KOGLER, Roman (Frauenauracher Str. 8091056 Erlangen), ROPPELT, Bernd (Am Pruhl 796173 Unterhaid), SCHMENGER, Jens (Frauenauracher Str. 8091056 Erlangen)

Abstract: The invention relates to a power semiconductor arrangement ...