GENEVA, July 6 -- QUALCOMM INCORPORATED filed a patent application (CN2024/141435) for “SIDE INLET AIR MOVING DEVICE (AMD) INCLUDING INLET HEAT EXCHANGER AND METHOD OF MANUFACTURE”. With publication no. WO/2026/137117, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G06F 1/20
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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