GENEVA, July 18 -- SOITEC filed a patent application (EP2025/087973) for “SIC-BASED COMPOSITE STRUCTURE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE FOR MICROELECTRONIC COMPONENTS USING THE COMPOSITE STRUCTURE”. With publication no. WO/2026/149778, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10P 90/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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