GENEVA, July 2 -- SIEMENS AKTIENGESELLSCHAFT filed a patent application (EP2025/086655) for “SHRINK FITTED ELECTRONIC DEVICE”. With publication no. WO/2026/131462, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 40/60
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....