GENEVA, Feb. 3 -- SHINCRON CO., LTD. (3-5, Minatomirai 4-chome, Nishi-ku, Yokohama-shi, Kanagawa2208680), 株式会社シンクロン (神奈川県横浜市西区みなとみらい四丁目３番５号) filed a patent application (PCT/JP2024/026380) for "METHOD FOR FORMING DOPANT-CONTAINING FILM AND REACTIVE SPUTTERING APPARATUS" on Jul 23, 2024. With publication no. WO/2026/022952, the details related to the patent application was published on Jan 29, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the W...