INTERNATIONAL PATENT: SHIN-ETSU HANDOTAI CO., LTD., 信越半導体株式会社 FILES APPLICATION FOR "SEMICONDUCTOR MEMORY DEVICE FOR HBM AND MANUFACTURING METHOD THEREFOR"

GENEVA, May 11 -- SHIN-ETSU HANDOTAI CO., LTD. (2-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo1000004), 信越半導体株式会社 (東京都千代田区大手町二丁目２番１号) filed a patent application (PCT/JP2025/032241) for "SEMICONDUCTOR MEMORY DEVICE FOR HBM AND MANUFACTURING METHOD THEREFOR" on Sep 12, 2025. With publication no. WO/2026/094448, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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