GENEVA, May 19 -- SHIN-ETSU CHEMICAL CO., LTD. (4-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1000005), 信越化学工業株式会社 (東京都千代田区丸の内一丁目４番１号) filed a patent application (PCT/JP2025/035993) for "HEAT-SOFTENABLE THERMALLY CONDUCTIVE SILICONE COMPOSITION AND HEAT-SOFTENABLE THERMALLY CONDUCTIVE CURED SILICONE PRODUCT" on Oct 10, 2025. With publication no. WO/2026/100290, the details related to the patent application was published on May 15, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed ...