INTERNATIONAL PATENT: SHENZHEN UNIVERSITY, 深圳大学 FILES APPLICATION FOR "FLUIDIZED SOLIDIFIED SOIL FOR 3D PRINTING AND METHOD FOR MANUFACTURING 3D PRINTING ADDITIVE STRUCTURE FILLED WITH FLUIDIZED SOLIDIFIED SOIL FOR 3D PRINTING"

GENEVA, Sept. 15 -- SHENZHEN UNIVERSITY (No. 3688, Nanhai Avenue, Yuehai, Nanshan DistrictShenzhen, Guangdong 518060), 深圳大学 (中国广东省深圳市南山区粤海街道南海大道3688号) filed a patent application (PCT/CN2024/080328) for "FLUIDIZED SOLIDIFIED SOIL FOR 3D PRINTING AND METHOD FOR MANUFACTURING 3D PRINTING ADDITIVE STRUCTURE FILLED WITH FLUIDIZED SOLIDIFIED SOIL FOR 3D PRINTING" on Mar 06, 2024. With publication no. WO/2025/184832, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classificatio...