INTERNATIONAL PATENT: SHENZHEN RUINA ELECTRONIC TECHNOLOGY DEVELOPMENT CO., LTD., 深圳瑞纳电子技术发展有限公司 FILES APPLICATION FOR "WAFER-LEVEL CHIP MANUFACTURING METHOD"

GENEVA, Jan. 26 -- SHENZHEN RUINA ELECTRONIC TECHNOLOGY DEVELOPMENT CO., LTD. (Room 14B, Lanse Haiyunju, Shixia North 1st Street, Fubao Subdistrict, Futian DistrictShenzhen, Guangdong 518017), 深圳瑞纳电子技术发展有限公司 (中国广东省深圳市福田区福保街道石厦北一街蓝色海云居14B) filed a patent application (PCT/CN2025/102110) for "WAFER-LEVEL CHIP MANUFACTURING METHOD" on Jun 19, 2025. With publication no. WO/2026/016725, the details related to the patent application was published on Jan 22, 2026.

Notably, the pa...