GENEVA, Feb. 1 -- SHANGHAI WANSHENG ALLOY MATERIALS CO., LTD. (Building 1, No. 60 Jinfu RoadBaoshan District, Shanghai 200000), 上海万生合金材料有限公司 (中国上海市宝山区锦富路60号1幢) filed a patent application (PCT/CN2025/083328) for "SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR" on Mar 19, 2025. With publication no. WO/2026/020851, the details related to the patent application was published on Jan 29, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIP...