GENEVA, Dec. 21 -- SHANGHAI INDUSTRIAL Mu TECHNOLOGY RESEARCH INSTITUTE (Building 1, No. 235, Chengbei Road, Jiading DistrictShanghai 201800), 上海新微技术研发中心有限公司 (中国上海市嘉定区城北路235号1号楼) filed a patent application (PCT/CN2024/109711) for "METHOD FOR MANUFACTURING MEMS PACKAGING STRUCTURE" on Aug 05, 2024. With publication no. WO/2025/255924, the details related to the patent application was published on Dec 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Inte...