GENEVA, Oct. 9 -- SMC CORPORATION filed a patent application (JP2026/010566) for “SENSOR UNIT AND SENSOR MODULE”. With publication no. WO/2026/211311, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G01N 27/41
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....