INTERNATIONAL PATENT: SENJU METAL INDUSTRY CO., LTD., 千住金属工業株式会社 FILES APPLICATION FOR "SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, ON-VEHICLE ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, ON-VEHICLE ELECTRONIC CIRCUIT DEVICE AND ECU ELECTRONIC CIRCUIT DEVICE"

GENEVA, Feb. 3 -- SENJU METAL INDUSTRY CO., LTD. (23, Senju-Hashido-cho, Adachi-ku, Tokyo1208555), 千住金属工業株式会社 (東京都足立区千住橋戸町２３番地) filed a patent application (PCT/JP2025/025770) for "SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, ON-VEHICLE ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, ON-VEHICLE ELECTRONIC CIRCUIT DEVICE, AND ECU ELECTRONIC CIRCUIT DEVICE" on Jul 18, 2025. With publication no. WO/2026/023575, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the Internat...