GENEVA, March 23 -- SEMILAB SEMICONDUCTOR PHYSICS LABORATORY CO., LTD. (Prielle Kornelia u. 2.H-1117 Budapest) filed a patent application (PCT/HU2025/050063) for "BONDED WAFER INSPECTION METHOD AND DEVICE" on Sep 10, 2025. With publication no. WO/2026/058012, the details related to the patent application was published on Mar 19, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KOVACS, Zsolt (Toth Aladar u. 5.H-1048 Budapest), DR. KOVACS, Zsolt (Meggyfa u. 11aH-2051 Biatorbagy), DR. KISS, Zoltan Tamas (Bank Ban u. 9.H-1115 Budapest)
Abstract: A bonded wafer inspection method and device for de...