International Patent: SEMICONDUCTOR PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE

GENEVA, June 19 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/096583) for “SEMICONDUCTOR PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE”. With publication no. WO/2026/103073, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 23/31

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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