International Patent: SEMICONDUCTOR PACKAGE MANUFACTURING METHODS USING HYBRID DIE BONDING WITH SPIN-ON SILOXANE MATERIALS

GENEVA, Oct. 9 -- HONEYWELL INTERNATIONAL INC. filed a patent application (US2026/022275) for “SEMICONDUCTOR PACKAGE MANUFACTURING METHODS USING HYBRID DIE BONDING WITH SPIN-ON SILOXANE MATERIALS”. With publication no. WO/2026/213525, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 80/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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