International Patent: SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND SEMICONDUCTOR DEVICE

GENEVA, Aug. 14 -- RESONAC CORPORATION filed a patent application (JP2025/004017) for “SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/167812, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 23/29

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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