International Patent: SEMICONDUCTOR DEVICE PROCESSING LIQUID, SUBSTRATE PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

GENEVA, July 6 -- TOKYO OHKA KOGYO CO., LTD. filed a patent application (JP2025/042427) for “SEMICONDUCTOR DEVICE PROCESSING LIQUID, SUBSTRATE PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD”. With publication no. WO/2026/140781, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G03F 7/42

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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