International Patent: SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SLURRY, AND ORGANIC MATERIAL

GENEVA, Sept. 18 -- RESONAC CORPORATION filed a patent application (JP2025/008569) for “SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SLURRY, AND ORGANIC MATERIAL”. With publication no. WO/2026/186135, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 21/60

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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