INTERNATIONAL PATENT: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC FILES APPLICATION FOR "SEMICONDUCTOR DEVICE ASSEMBLIES WITH DIE ADHESIVE OUTFLOW BARRIERS"

GENEVA, May 12 -- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (5701 N. Pima RoadScottsdale, Arizona 85250) filed a patent application (PCT/US2025/016427) for "SEMICONDUCTOR DEVICE ASSEMBLIES WITH DIE ADHESIVE OUTFLOW BARRIERS" on Feb 19, 2025. With publication no. WO/2026/095975, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JI, Sixin (YuXianHuaYuan#99 DongGao RoadNanTong, Jiangsu 226000), CHANG, Jie (Building 2, room 703ZhongNanHuaYuanSuzhou, Jiangsu 215021), TIAN, Yanghai (Aoyun Garden, #66 Qiongji RoadSuzhou Industrial ...