GENEVA, Aug. 14 -- CORINTIS SA filed a patent application (EP2026/052191) for “SEMICONDUCTOR ASSEMBLIES AND METHODS FOR COOLING A SEMICONDUCTOR ASSEMBLY AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR ASSEMBLY”. With publication no. WO/2026/166848, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H10W 40/47
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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