International Patent: SEMICONDUCTOR ARRANGEMENT WITH INTERCONNECTION COMPOSITE METAL LAYER

GENEVA, Aug. 21 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (EP2025/053704) for “SEMICONDUCTOR ARRANGEMENT WITH INTERCONNECTION COMPOSITE METAL LAYER”. With publication no. WO/2026/171349, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 23/48

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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