GENEVA, March 3 -- SEKISUI HOUSE,LTD. (1-88, Oyodonaka 1-chome, Kita-ku, Osaka-shi Osaka5310076), 積水ハウス株式会社 (大阪府大阪市北区大淀中１丁目１番８８号) filed a patent application (PCT/JP2025/019278) for "STRUCTURE FOR JOINING WOODEN MATERIAL TO STEEL STRUCTURAL MATERIAL AND METHOD FOR JOINING WOODEN MATERIAL TO STEEL STRUCTURAL MATERIAL" on May 28, 2025. With publication no. WO/2026/042364, the details related to the patent application was published on Feb 26, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system...