GENEVA, March 18 -- SEKISUI CHEMICAL CO., LTD. (4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi, Osaka5308565), 積水化学工業株式会社 (大阪府大阪市北区西天満２丁目４番４号) filed a patent application (PCT/JP2025/031499) for "MOISTURE-CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENT, CURED BODY, AND ELECTRONIC COMPONENT" on Sep 05, 2025. With publication no. WO/2026/054062, the details related to the patent application was published on Mar 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is manage...