GENEVA, Oct. 5 -- RESONAC CORPORATION filed a patent application (JP2026/012984) for “SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/205570, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08G 59/40
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....