GENEVA, April 18 -- SCHAEFFLER TECHNOLOGIES AG & CO. KG (IndustriestraBe 1-391074 Herzogenaurach) filed a patent application (PCT/EP2025/075678) for "TOOL FOR FIXING AT LEAST ONE POWER SEMICONDUCTOR CHIP DURING A SOLDERING PROCESS" on Sep 09, 2025. With publication no. WO/2026/077629, the details related to the patent application was published on Apr 16, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): BOHMER, Janis (c/o Vitesco Technologies GmbHLandsberger StraBe 187 - Haus D80687 Munchen), HOLVERSCHEID, Joshua (c/o Vitesco Technologies GmbHLandsberger StraBe 187 - Haus D80687 Munchen)
Abst...