INTERNATIONAL PATENT: SANDISK TECHNOLOGIES, INC. FILES APPLICATION FOR "THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THERMALLY CONDUCTIVE AND INSULATING TRENCH FILL STRUCTURE AND METHODS FOR FORMING THE SAME USING LASER ANNEALING"

GENEVA, April 29 -- SANDISK TECHNOLOGIES, INC. (951 Sandisk DriveMilpitas, California 95035) filed a patent application (PCT/US2025/026909) for "THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THERMALLY CONDUCTIVE AND INSULATING TRENCH FILL STRUCTURE AND METHODS FOR FORMING THE SAME USING LASER ANNEALING" on Apr 29, 2025. With publication no. WO/2026/084751, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MINAGAWA, Wataru (c/o Sandisk Technologies, Inc.951 Sandisk DriveMilpitas, California 95035), TANII, Tsutomu (c/o Sandisk T...