INTERNATIONAL PATENT: SAMSUNG SDI CO., LTD., 삼성에스디아이 주식회사 FILES APPLICATION FOR "RESIST UNDERLAYER COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION"

GENEVA, Dec. 16 -- SAMSUNG SDI CO., LTD. (150-20 Gongse-ro, Giheung-gu,Yongin-si,Gyeonggi-do 17084), 삼성에스디아이 주식회사 (경기도용인시기흥구 공세로 150-20) filed a patent application (PCT/KR2024/017308) for "RESIST UNDERLAYER COMPOSITION, AND METHOD OF FORMING PATTERNS USING THE COMPOSITION" on Nov 05, 2024. With publication no. WO/2025/254266, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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