INTERNATIONAL PATENT: SAMSUNG ELECTRONICS CO., LTD. FILES APPLICATION FOR "METHOD AND APPARATUS FOR IMPROVEMENTS ASSOCIATED WITH A SLICING IN A COMMUNICATION SYSTEM"

GENEVA, Dec. 2 -- SAMSUNG ELECTRONICS CO., LTD. (129, Samsung-ro,Yeongtong-gu, Suwon-si,Gyeonggi-do 16677) filed a patent application (PCT/KR2025/006938) for "METHOD AND APPARATUS FOR IMPROVEMENTS ASSOCIATED WITH A SLICING IN A COMMUNICATION SYSTEM" on May 22, 2025. With publication no. WO/2025/244429, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WATFA, Mahmoud (Samsung Electronics (UK) Limited Samsung ElectronicsResearch Institute, Communications House,South Street Staines Middlesex TW18 4QE)

Abstract: The disclosure...