INTERNATIONAL PATENT: ROBERT BOSCH GMBH FILES APPLICATION FOR "DBC SUBSTRATE, PARTIALLY SURROUNDED BY A MOLD MATERIAL, OF A POWER MODULE"

GENEVA, March 19 -- ROBERT BOSCH GMBH (Postfach 30 02 2070442 Stuttgart) filed a patent application (PCT/EP2025/074868) for "DBC SUBSTRATE, PARTIALLY SURROUNDED BY A MOLD MATERIAL, OF A POWER MODULE" on Sep 02, 2025. With publication no. WO/2026/052590, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GAISER, Patrick (Lilienstr. 1072764 Reutlingen)

Abstract: The invention relates to a DBC substrate (20), in particular a ceramic DBC substrate (20) of a power module (10) provided at least partially with a mold material (18)...