INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "SEMICONDUCTOR PACKAGE, RESIN MEMBER FOR SEMICONDUCTOR PACKAGE AND RESIN MOLDING MATERIAL FOR RESIN MEMBER OF SEMICONDUCTOR PACKAGE"

GENEVA, April 6 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/028813) for "SEMICONDUCTOR PACKAGE, RESIN MEMBER FOR SEMICONDUCTOR PACKAGE, AND RESIN MOLDING MATERIAL FOR RESIN MEMBER OF SEMICONDUCTOR PACKAGE" on Aug 15, 2025. With publication no. WO/2026/070089, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Int...