INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "SEALING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE"

GENEVA, March 10 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/029765) for "SEALING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE" on Aug 25, 2025. With publication no. WO/2026/048746, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MIURA, Tomohiro (c/...