INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "RESIN COMPOSITION, RESIN FILM, RESIN FILM WITH SUPPORT, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE"

GENEVA, Feb. 23 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/028946) for "RESIN COMPOSITION, RESIN FILM, RESIN FILM WITH SUPPORT, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE" on Aug 14, 2024. With publication no. WO/2026/038318, the details related to the patent application was published on Feb 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizat...