INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "RELEASE FILM, BASE MATERIAL FOR RELEASE FILM, METHOD FOR PRODUCING RELEASE FILM AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE"

GENEVA, Dec. 22 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/021758) for "RELEASE FILM, BASE MATERIAL FOR RELEASE FILM, METHOD FOR PRODUCING RELEASE FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE" on Jun 14, 2024. With publication no. WO/2025/258078, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intelle...