INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD OF PRODUCING METAL-CLAD LAMINATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND METHOD OF PRODUCING SAME AND SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING SAME"

GENEVA, Dec. 23 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/020974) for "METHOD OF PRODUCING METAL-CLAD LAMINATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND METHOD OF PRODUCING SAME, AND SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING SAME" on Jun 10, 2025. With publication no. WO/2025/258595, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) syste...