INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "MATERIAL STRUCTURE PREDICTION DEVICE, MATERIAL MANUFACTURING DEVICE, MATERIAL STRUCTURE PREDICTION METHOD, MATERIAL MANUFACTURING METHOD AND MATERIAL STRUCTURE PREDICTION PROGRAM"

GENEVA, April 14 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/033964) for "MATERIAL STRUCTURE PREDICTION DEVICE, MATERIAL MANUFACTURING DEVICE, MATERIAL STRUCTURE PREDICTION METHOD, MATERIAL MANUFACTURING METHOD, AND MATERIAL STRUCTURE PREDICTION PROGRAM" on Sep 26, 2025. With publication no. WO/2026/075013, the details related to the patent application was published on Apr 09, 2026.

Notably, the patent application was submitted under the International Patent Classificatio...