INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "LAMINATED BODY, LAMINATED PLATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, INTERPOSER AND BALL GRID ARRAY SUBSTRATE"

GENEVA, Sept. 21 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2024/009952) for "LAMINATED BODY, LAMINATED PLATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, INTERPOSER, AND BALL GRID ARRAY SUBSTRATE" on Mar 14, 2024. With publication no. WO/2025/191779, the details related to the patent application was published on Sep 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual P...