GENEVA, Feb. 17 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/028008) for "HEAT-CURABLE COMPOSITION, CURED OBJECT THEREOF, PHOTO-MELTABLE COMPOSITION, METHOD FOR PRODUCING STRUCTURE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND POLYTHIOL COMPOUND" on Aug 06, 2025. With publication no. WO/2026/034569, the details related to the patent application was published on Feb 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC)...