GENEVA, March 24 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/032221) for "FILM ADHESIVE, DICING DIE-BONDING FILM, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SAME" on Sep 11, 2025. With publication no. WO/2026/058943, the details related to the patent application was published on Mar 19, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO)...