GENEVA, Dec. 30 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/021975) for "DIE BONDING FILM AND METHOD FOR MANUFACTURING SAME, DICING/DIE BONDING INTEGRATED FILM AND METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME" on Jun 18, 2025. With publication no. WO/2025/263551, the details related to the patent application was published on Dec 26, 2025.
Notably, the patent application was submitted under the International Patent Classificatio...