GENEVA, March 10 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/030169) for "ADHESIVE COMPOSITION, METHOD FOR PRODUCING SAME, ADHESIVE SHEET, DICING TAPE, DICING/DIE BONDING INTEGRATED FILM, AND METHOD FOR PRODUCING (METH)ACRYLIC RESIN" on Aug 27, 2025. With publication no. WO/2026/048893, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which...