GENEVA, July 1 -- RAPIDUS CORPORATION filed a patent application (JP2025/026333) for “RESIST FILM FORMING COMPOSITION, RESIST LAYER, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD”. With publication no. WO/2026/126562, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G03F 7/004
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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