GENEVA, Aug. 31 -- TOKYO OHKA KOGYO CO., LTD. filed a patent application (JP2026/004623) for “RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, AND COMPOUND”. With publication no. WO/2026/176988, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G03F 7/004
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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