GENEVA, July 2 -- TOWA CORPORATION filed a patent application (JP2025/025233) for “RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING MOLDED RESIN ARTICLE”. With publication no. WO/2026/133614, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B29C 45/26
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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