International Patent: RESIN FILM, LAMINATED FILM, PACKAGING MATERIAL, PACKAGING BAG, AND PACKAGE

GENEVA, Sept. 18 -- DAI NIPPON PRINTING CO., LTD. filed a patent application (JP2026/008088) for “RESIN FILM, LAMINATED FILM, PACKAGING MATERIAL, PACKAGING BAG, AND PACKAGE”. With publication no. WO/2026/186776, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B32B 27/18

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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