GENEVA, Oct. 15 -- AGC INC. filed a patent application (JP2026/013253) for “RESIN COMPOSITION, RESIN FILM, LAMINATE, RESIN SHEET, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/216380, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 101/00
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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