GENEVA, Aug. 14 -- FUJIFILM CORPORATION filed a patent application (JP2026/001961) for “RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/168165, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 79/08
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....