GENEVA, Oct. 15 -- MITSUBISHI CHEMICAL CORPORATION filed a patent application (JP2026/014428) for “RESIN COMPOSITION, MOLDING MATERIAL, PELLETS, SOLUTION, MOLDED BODY, MULTILAYER STRUCTURE, AND FILM”. With publication no. WO/2026/216542, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08L 29/04
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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