GENEVA, Oct. 5 -- JSR CORPORATION filed a patent application (JP2026/011419) for “RESIN COMPOSITION, CURED PRODUCT, PREPREG, COPPER-CLAD LAMINATE, INTERLAYER INSULATING FILM, AND COMPOUND”. With publication no. WO/2026/204905, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08F 283/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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