GENEVA, Oct. 9 -- NIPPON KAYAKU KABUSHIKI KAISHA filed a patent application (JP2026/012109) for “RESIN COMPOSITION, CURED FILM OF SAME, SEMICONDUCTOR ELEMENT PROVIDED WITH SURFACE PROTECTIVE FILM, INTERLAYER INSULATING FILM, OR REDISTRIBUTION-LAYER INSULATING FILM CONTAINING RESIN COMPOSITION, AND DRY FILM RESIST”. With publication no. WO/2026/211507, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C08F 222/40
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....